基本信息:
- 专利标题： 芯片键合装置及其键合方法
- 专利标题（英）：Chip bonding device and chip bonding method
- 申请号：CN201610470114.1 申请日：2016-06-23
- 公开(公告)号：CN107546137A 公开(公告)日：2018-01-05
- 发明人： 郭耸 , 孙见奇 , 陈飞彪 , 朱岳彬 , 王天明 , 夏海
- 申请人： 上海微电子装备(集团)股份有限公司
- 申请人地址： 上海市浦东新区张东路1525号
- 专利权人： 上海微电子装备(集团)股份有限公司
- 当前专利权人： 上海微电子装备(集团)股份有限公司
- 当前专利权人地址： 上海市浦东新区张东路1525号
- 代理机构： 上海思微知识产权代理事务所
- 代理人： 屈蘅; 李时云
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/78
The invention discloses a chip bonding device and a chip bonding method. The chip bonding device comprises at least one separation module, at least one bonding module, a transmission device and a control device, and is characterized in that the separation module is used for separating a chip; the bonding module is used for bonding the chip and a substrate; the transmission device transmits the chip between the separation module and the bonding module, the transmission device comprises at least one guide rail and at least one transmission carrier used for carrying the chip, and each guide railis provided with at least one transmission carrier; and the control device respectively controls the separation module, the bonding module and the transmission device. The chip bonding method is implemented by the chip bonding device, thereby being capable of realizing batch pickup of the chips, batch transmission of the chips and batch bonding of the chips and substrates, being capable of effectively improving the yield of chip bonding, and improving the accuracy of chip bonding.
公开/授权文献:
- CN107546137B 芯片键合装置及其键合方法 公开/授权日：2019-11-26
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/60 | ....引线或其他导电构件的连接，用于工作时向或由器件传导电流 |