基本信息:
- 专利标题： 发光二极管封装结构
- 申请号：CN201610405811.9 申请日：2016-06-08
- 公开(公告)号：CN107482099B 公开(公告)日：2019-09-10
- 发明人： 林裕洲 , 林贞秀 , 陈志源
- 申请人： 光宝光电(常州)有限公司 , 光宝科技股份有限公司
- 申请人地址： 江苏省常州市武进高新技术产业开发区阳湖路88号
- 专利权人： 光宝光电(常州)有限公司,光宝科技股份有限公司
- 当前专利权人： 光宝光电(常州)有限公司,光宝科技股份有限公司
- 当前专利权人地址： 江苏省常州市武进高新技术产业开发区阳湖路88号
- 代理机构： 隆天知识产权代理有限公司
- 代理人： 李昕巍; 郑泰强
- 主分类号： H01L33/48
- IPC分类号： H01L33/48 ; H01L33/52 ; H01L33/62
An LED package structure includes a substrate (1), a circuit layer (2) and an insulating layer (4) both disposed on the substrate (1), a light-emitting unit (5), and a reflective housing (7) integrally formed with the insulating layer (4). The light-emitting unit (5) includes an LED chip (51) and a fluorescent body (52) encapsulating the LED chip (51). The light-emitting unit (5) is mounted on the insulating layer (4) and the circuit layer (2). The fluorescent body (52) of the light emitting unit is spaced apart from the circuit layer (2) with a gap (G) in a range of 3ˆ¼10µm. The reflective housing (7) is formed on the insulating layer (4) and the circuit layer (2) and is further filled within the gap (G). A top plane (71) of the reflective housing (7) arranged away from the substrate (1) is lower than or equal to that of the light-emitting unit (5), and a distance (D4) between the two top planes (71, 521) is in a range of 0ˆ¼30µm.
公开/授权文献:
- CN107482099A 发光二极管封装结构 公开/授权日：2017-12-15