
基本信息:
- 专利标题: 基板、功率模块封装及图案化的绝缘金属基板的制造方法
- 专利标题(英):Substrate, power module package and manufacture method for insulation metal substrate
- 申请号:CN201610559866.5 申请日:2016-07-15
- 公开(公告)号:CN107342275A 公开(公告)日:2017-11-10
- 发明人: 蔡欣昌 , 李嘉炎 , 李芃昕
- 申请人: 台达电子工业股份有限公司
- 申请人地址: 中国台湾桃园市
- 专利权人: 台达电子工业股份有限公司
- 当前专利权人: 台达电子工业股份有限公司
- 当前专利权人地址: 中国台湾桃园市
- 代理机构: 隆天知识产权代理有限公司
- 代理人: 张福根; 冯志云
- 优先权: 15/142,458 2016.04.29 US
- 主分类号: H01L23/495
- IPC分类号: H01L23/495 ; H01L21/48
The substrate comprises a metal bearing plate, a patterned insulation layer and a patterned condcutive lyaer, wherein the patterned insulation layer is arranged on the metal bearing plate and partially covers the metal bearing plate; the patterned conductive layer is arranged on the patterned insulation layer. The invention also provides a power module package comprising the substrate and a manufacutre method for the substrate; the invention provides a power module package of the patterned insulation metal substrate (PIMS); because the patterned insulation layer in the insulation metal substrate does not block heat transmission generated by a semiconductor power wafer installed on the substrate, the power module package can have a better heat radiation fucntion and has higher reliability.
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L23/00 | 半导体或其他固态器件的零部件 |
--------H01L23/34 | .冷却装置;加热装置;通风装置或温度补偿装置 |
----------H01L23/482 | ..由不可拆卸地施加到半导体本体上的内引线组成的 |
------------H01L23/495 | ...引线框架的 |