The invention relates to a piezoresistive compound sensor suitable for a surface mounting technology and a manufacturing method thereof. The piezoresistive compound sensor comprises a planar integrated or vertical integrated structure; a used wafer structure comprises a substrate layer, a top layer, an insulating layer in the wafer and cavities arranged at interface positions in the substrate layer and the insulating layer, wherein the top layer and the substrate layer are doped in a reversal phase manner; an electric isolation groove is arranged on the substrate layer; metal pins are formed on the substrate layer surrounded by the electric isolation groove; a piezoresistive strip of the compound sensor, an electrical lead wire area and an electric connection channel are formed on the top layer, and the electric connection channel is arranged in the overlapped area of the electrical lead wire area and substrate silicon ; releasing grooves are arranged on the insulating layer on the surface of the top layer, top layer silicon and the insulating layer in the wafer to form a movable structure of the compound sensor, and a protective cover plate is linked to form a sealed cavity The piezoresistive compound sensor provided by the invention is convenient for subsequently achieving three-dimensional packaging with a corresponding control circuit (IC), and is low in cost.