基本信息:
- 专利标题： 一种导电胶及制备方法
- 专利标题（英）：Conductive adhesive and preparation method
- 申请号：CN201710609864.7 申请日：2017-07-25
- 公开(公告)号：CN107254287A 公开(公告)日：2017-10-17
- 发明人： 孔令翠
- 申请人： 合肥欧仕嘉机电设备有限公司
- 申请人地址： 安徽省合肥市经济技术开发区繁华大道南、松林路东碧湖蓝庭1幢3—505室
- 专利权人： 合肥欧仕嘉机电设备有限公司
- 当前专利权人： 合肥欧仕嘉机电设备有限公司
- 当前专利权人地址： 安徽省合肥市经济技术开发区繁华大道南、松林路东碧湖蓝庭1幢3—505室
- 代理机构： 合肥道正企智知识产权代理有限公司
- 代理人： 武金花
- 主分类号： C09J163/00
- IPC分类号： C09J163/00 ; C09J161/06 ; C09J9/02 ; C09J11/04 ; C09J11/06
The invention provides a conductive adhesive and a preparation method. The conductive adhesive comprises the following components: a modified epoxy resin, a phenolic resin, silver-plated copper powder, graphite, a diluent, a defoaming agent, a curing agent and an accelerant. The preparation method comprises the following steps: firstly, uniformly mixing and stirring the modified epoxy resin and the phenolic resin, sequentially adding the rest components, enabling the components to sufficiently react, and uniformly mixing; putting the components into a half-automatic liquid filling machine, and filling an adhesive tube with the mixture, thereby obtaining the conductive adhesive. The conductive adhesive provided by the invention is relatively good in binding firmness, good in thermal resistance and excellent in electric conductivity, and has a relatively high use value.