基本信息:
- 专利标题： 表面处理铜箔及使用了它的层叠板
- 专利标题（英）：Surface treated copper foil and laminate using the same
- 申请号：CN201710321304.1 申请日：2013-11-11
- 公开(公告)号：CN107249263A 公开(公告)日：2017-10-13
- 发明人： 新井英太 , 三木敦史 , 新井康修 , 中室嘉一郎
- 申请人： JX日矿日石金属株式会社
- 申请人地址： 日本东京都
- 专利权人： JX日矿日石金属株式会社
- 当前专利权人： JX日矿日石金属株式会社
- 当前专利权人地址： 日本东京都
- 代理机构： 北京信慧永光知识产权代理有限责任公司
- 代理人： 王玉玲; 李雪春
- 优先权： 2012-247916 20121109 JP 2012-288815 20121228 JP 2013-013710 20130128 JP
- 主分类号： H05K3/38
- IPC分类号： H05K3/38 ; C25D7/06 ; C25D1/04 ; H05K1/03 ; H05K3/02
A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. A surface treated copper foil comprising at least one surface treated surface with a color difference delta E*ab of 40 or more based on JIS Z 8730, and a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an end of the copper foil to a portion without the copper foil delta B (delta B=Bt-Bb) of 40 or more, after lamination of the surface treated surface to a polyimide having a delta B (PI) defined as above of 50 or more and 65 or less before being laminated to the copper foil, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide with a CCD camera for the respective observation spots along the direction perpendicular to the extending direction of the observed copper foil.
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/38 | .绝缘基片和金属之间黏合的改进 |