
基本信息:
- 专利标题: 半导体激光器的腔面制备方法及其腔面制备装置
- 专利标题(英):Cavity surface preparation method of semiconductor laser and cavity surface preparation device thereof
- 申请号:CN201710572640.3 申请日:2017-07-13
- 公开(公告)号:CN107230932A 公开(公告)日:2017-10-03
- 发明人: 王鑫 , 赵懿昊 , 朱凌妮 , 王翠鸾 , 刘素平 , 马骁宇
- 申请人: 中国科学院半导体研究所
- 申请人地址: 北京市海淀区清华东路甲35号
- 专利权人: 中国科学院半导体研究所
- 当前专利权人: 中国科学院半导体研究所
- 当前专利权人地址: 北京市海淀区清华东路甲35号
- 代理机构: 中科专利商标代理有限责任公司
- 代理人: 任岩
- 主分类号: H01S5/18
- IPC分类号: H01S5/18
The invention provides a cavity surface preparation method of a semiconductor laser and a cavity surface preparation device thereof. The method comprises the following steps: placing a wafer strip with a cleavage line into a cleavage cavity, and cleaving by the cleavage cavity according to the cleavage line to obtain at least one bar; transmitting the at least one bar to a passivation cavity, so as to passivate two cavity surfaces of each bar; and transmitting the at least one bar to a coating cavity, evaporating a high reflective film and a high transparent film on the two cavity surfaces of each bar respectively, and finishing the cavity surface preparation of the semiconductor laser, wherein the cleavage cavity, the cleavage cavity and the coating cavity are all in the vacuum state. The cavity surface preparation method of the semiconductor laser provided by the invention cleaves and passivates the semiconductor laser in the vacuum state, and directly evaporates optical films of front and rear cavity surfaces of the semiconductor laser in a vacuum, which can effectively avoid the optical films from being contacted with air, avoid the contamination of the cavity surfaces by impurities such as oxygen and carbon in air, and avoid the formation of a surface state on the cavity surfaces, so as to effectively suppress the generation of catastrophic optical damage of the cavity surfaces.