基本信息:
- 专利标题： 模制产品的制造方法及模制产品
- 专利标题（英）：Manufacturing Method Of Molded Product And Molded Product
- 申请号：CN201710107358.8 申请日：2017-02-27
- 公开(公告)号：CN107204296A 公开(公告)日：2017-09-26
- 发明人： 稻叶祐树
- 申请人： 富士电机株式会社
- 申请人地址： 日本神奈川县川崎市
- 专利权人： 富士电机株式会社
- 当前专利权人： 富士电机株式会社
- 当前专利权人地址： 日本神奈川县川崎市
- 代理机构： 北京铭硕知识产权代理有限公司
- 代理人： 孙昌浩; 李盛泉
- 优先权： 2016-055688 20160318 JP
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/49
Provided is a molded product manufacturing method, including attachment of attaching a partially exposed member that extends from inside a sealed portion in the molded product to be exposed to outside to a sealing target member that is to be sealed inside the sealed portion in the molded product; injecting of inserting the sealing target member having the partially exposed member attached thereto in a die and injecting a sealing material into the die; adjustment of, in a first time period during which the sealing material is injected, holding the partially exposed member at a position differing from a final position in the molded product and adjusting a flow of the sealing material with an adjusting member attached to the partially exposed member; and hardening the sealing material after the first time period.
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/02 | .半导体器件或其部件的制造或处理 |
| ----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |
| ------------H01L21/50 | ...应用H01L21/06至H01L21/326中的任一小组都不包含的方法或设备组装半导体器件的 |
| --------------H01L21/56 | ....封装，例如密封层、涂层 |