The invention provides a printed circuit board device manufacture method. The method comprises the steps that a PCB hard board is acquired; a solder paste printer is used to coat solder paste on the pad of the PCB hard board; whether the solder paste coated on the pad by the solder paste printer is qualified is detected; a corresponding electronic component is surface-mounted on the qualified pad detected by an SPI solder paste detector; welding operation is carried out on the electronic component on the corresponding pad; defect detection is carried out on the PCB hard board on which the electronic component is welded; an automatic glue sprayer is used to glue and cover the welding area of the electronic component and the pad on the PCB hard board whose defect detection is qualified; high temperature curing is carried out on the glued and covered PCB hard board; an FPC soft board is acquired, and a soft and hard board assembly fixture is used to assemble the PCB hard board after high temperature curing and the FPC soft board; and the PCB hard board and the FPC soft board on the soft and hard board assembly fixture are welded to form a printed circuit board device.