![一种LED封装工艺](/CN/2017/1/56/images/201710281779.jpg)
基本信息:
- 专利标题: 一种LED封装工艺
- 申请号:CN201710281779.2 申请日:2017-04-26
- 公开(公告)号:CN107195760B 公开(公告)日:2020-01-17
- 发明人: 韩邦勇
- 申请人: 安徽欧瑞特照明有限公司
- 申请人地址: 安徽省六安市霍山县与儿街镇大沙埂
- 专利权人: 安徽欧瑞特照明有限公司
- 当前专利权人: 安徽欧瑞特照明有限公司
- 当前专利权人地址: 安徽省六安市霍山县与儿街镇大沙埂
- 代理机构: 六安众信知识产权代理事务所
- 代理人: 黎照西
- 主分类号: H01L33/50
- IPC分类号: H01L33/50 ; H01L33/56
An LED packaging process belongs to the technical field of LED lamp manufacturing, and comprises the steps of: (1) selecting a silver paste and fluorescent powder, and mixing the silver paste and the fluorescent powder together and heating the mixture to obtain a mixed liquid a; (2) adding an enhancer into the mixed liquid a, heating while stirring the mixture, and subjecting the mixture to thermal insulation treatment to obtain a mixture b; (3) pouring the mixture b into a mold for forming, taking out the formed mixture to obtain a mixture c, and adhering the mixture c between a chip and a bracket to obtain a semi-finished LED; (4) putting the semi-finished LED into an oven for primary baking; (5) subjecting the semi-finished LED after primary baking to secondary baking, namely, high-pressure baking, and cooling the semi-finished LED after secondary baking to room temperature to obtain a finished LED packaging product. The finished LED packaging product prepared by adopting the LED packaging process has the advantages of high radiating performance and high light emitting efficiency. The LED packaging process improves the stability of the LED and prolongs the service life. The LED packaging process is firm in adhesion, and improves the light emitting efficiency of the LED.
公开/授权文献:
- CN107195760A 一种LED封装工艺 公开/授权日:2017-09-22