![脆性基板的分割方法](/CN/2017/1/20/images/201710100502.jpg)
基本信息:
- 专利标题: 脆性基板的分割方法
- 专利标题(英):METHOD OF DIVIDING BRITTLE SUBSTRATE
- 申请号:CN201710100502.5 申请日:2017-02-23
- 公开(公告)号:CN107127899A 公开(公告)日:2017-09-05
- 发明人: 曾山浩
- 申请人: 三星钻石工业股份有限公司
- 申请人地址: 日本大阪
- 专利权人: 三星钻石工业股份有限公司
- 当前专利权人: 三星钻石工业股份有限公司
- 当前专利权人地址: 日本大阪
- 代理机构: 北京康信知识产权代理有限责任公司
- 代理人: 田喜庆; 吴孟秋
- 优先权: 2016-035039 20160226 JP
- 主分类号: B28D1/22
- IPC分类号: B28D1/22 ; B28D5/00 ; C03B33/10
A method of dividing a brittle substrate allows a cutter head to be easily prepared and ensures enough service life of the cutter head when the cutter head having a top point formed by combinding three surfaces is slided with ridge as a rear side. The cutter head includes a first surface (SD1), a second surface (SD2) and a third surface (SD3). The second surface (SD2) is adjacent to the first surface (SD1) and the third surface (SD3) is adjacent to the second surface (SD2) thus forming the ridge. The third surface (SD3) is adjacent to both of the first surface (SD1) and the second surface (SD2) to form the top point. The ridge is not subjected to chamfering. One one surface (SF1) of the brittle substrate (4), the cutter head (51) slides towards the first surface (SD1) along the ridge (PS), so that a trough line (TL) having a groove-like shape is formed on one surface (SF1) of the brittle substrate (4) without cracks. A crack line (CL) is formed along the trough line (TL), thereby dividing the brittle substrate along the crack line (CL).
公开/授权文献:
- CN107127899B 脆性基板的分割方法 公开/授权日:2021-09-24
IPC结构图谱:
B | 作业;运输 |
--B28 | 加工水泥、黏土或石料 |
----B28D | 加工石头或类似石头的材料 |
------B28D1/00 | 不包含在其他类目中的石头或类似石头的材料,例如砖、混凝土的加工;所用的机械、装置、工具 |
--------B28D1/22 | .通过切割,例如切开 |