基本信息:
- 专利标题： 激光加工机
- 专利标题（英）：Laser processing device
- 申请号：CN201710047965.X 申请日：2017-01-20
- 公开(公告)号：CN107020450A 公开(公告)日：2017-08-08
- 发明人： 森敦 , 望月树也
- 申请人： 发那科株式会社
- 申请人地址： 日本山梨县
- 专利权人： 发那科株式会社
- 当前专利权人： 发那科株式会社
- 当前专利权人地址： 日本山梨县
- 代理机构： 北京林达刘知识产权代理事务所
- 代理人： 刘新宇
- 优先权： 2016-015487 20160129 JP
- 主分类号： B23K26/046
- IPC分类号： B23K26/046
A laser processing device configured to generally vertically irradiate a laser beam to a workpiece, and having a function for reducing an adverse effect due to a reflected laser beam from the workpiece. The laser processing device includes: a light condensing point moving part configured to move a focal point in an optical axis direction while irradiating the laser beam, by moving at least one of a processing head, an optical component of a light condense optical system, and a workpiece; and a light condensing point distance setting part configured to set a light condensing point distance between the light condensing point and a workpiece surface when the laser beam is started to be irradiated, wherein the light condensing point distance is set so that an amount of the reflected laser beam returned to the processing head through the optical system is not more than an allowable value.
公开/授权文献:
- CN107020450B 激光加工机 公开/授权日：2019-10-15
IPC结构图谱:
| B | 作业；运输 |
| --B23 | 机床；不包含在其他类目中的金属加工 |
| ----B23K | 钎焊或脱焊；焊接；用钎焊或焊接方法包覆或镀敷；局部加热切割，如火焰切割；用激光束加工 |
| ------B23K26/00 | 用激光束加工，例如焊接，切割，打孔 |
| --------B23K26/02 | .工件的定位和观测，如相对于冲击点，激光束的对正，瞄准或聚焦 |
| ----------B23K26/04 | ..激光束的自动对正，瞄准或聚焦，如应用反向散射光 |
| ------------B23K26/046 | ...激光束的自动聚焦 |