
基本信息:
- 专利标题: 绕线型电子元件及其陶瓷底板
- 专利标题(英):Winding type electronic component and ceramic bottom board thereof
- 申请号:CN201710216089.9 申请日:2017-04-01
- 公开(公告)号:CN107017209A 公开(公告)日:2017-08-04
- 发明人: 胡利华 , 王海 , 朱建华 , 陈益芳 , 王智会
- 申请人: 深圳振华富电子有限公司 , 中国振华(集团)科技股份有限公司
- 申请人地址: 广东省深圳市龙华清湖和平东路振华工业园4F;
- 专利权人: 深圳振华富电子有限公司,中国振华(集团)科技股份有限公司
- 当前专利权人: 深圳振华富电子有限公司,中国振华(集团)科技股份有限公司
- 当前专利权人地址: 广东省深圳市龙华清湖和平东路振华工业园4F;
- 代理机构: 广州华进联合专利商标代理有限公司
- 代理人: 潘霞
- 主分类号: H01L23/15
- IPC分类号: H01L23/15 ; H01L23/492
The invention relates to a winding type electronic component and a ceramic bottom board thereof. The ceramic bottom board is used for fixing a body of the electronic component in manufacturing of the winding type electronic component. The ceramic bottom board comprises a ceramic dielectric layer, wherein a first surface and a second surface of the ceramic dielectric layer are respectively provided with bonding pads, and the first surface and the second surface are two opposite surfaces of the ceramic dielectric layer; the side surfaces, which are perpendicular to the first surface and the second surface, of the ceramic bottom board are provided with welding slots; the welding slots are connected with the bonding pads at the second surface, and the welding slots are not connected with the bonding pads at the first surface. According to the ceramic bottom board, the side surfaces, which are perpendicular to the first surface and the second surface, of the ceramic bottom board are provided with the welding slots, so that the weldability of the ceramic bottom board is enhanced.
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L23/00 | 半导体或其他固态器件的零部件 |
--------H01L23/02 | .容器;封接 |
----------H01L23/14 | ..按其材料或它的电性能区分的 |
------------H01L23/15 | ...陶瓷或玻璃衬底 |