The invention relates to a winding type electronic component and a ceramic bottom board thereof. The ceramic bottom board is used for fixing a body of the electronic component in manufacturing of the winding type electronic component. The ceramic bottom board comprises a ceramic dielectric layer, wherein a first surface and a second surface of the ceramic dielectric layer are respectively provided with bonding pads, and the first surface and the second surface are two opposite surfaces of the ceramic dielectric layer; the side surfaces, which are perpendicular to the first surface and the second surface, of the ceramic bottom board are provided with welding slots; the welding slots are connected with the bonding pads at the second surface, and the welding slots are not connected with the bonding pads at the first surface. According to the ceramic bottom board, the side surfaces, which are perpendicular to the first surface and the second surface, of the ceramic bottom board are provided with the welding slots, so that the weldability of the ceramic bottom board is enhanced.