![一种超结碳化硅器件及其制备方法](/CN/2016/1/246/images/201611231894.jpg)
基本信息:
- 专利标题: 一种超结碳化硅器件及其制备方法
- 专利标题(英):Super-junction silicon carbide device and preparation method thereof
- 申请号:CN201611231894.0 申请日:2016-12-28
- 公开(公告)号:CN106876463A 公开(公告)日:2017-06-20
- 发明人: 杨霏 , 钮应喜 , 夏经华 , 李玲 , 郑柳 , 刘瑞 , 查祎英 , 田亮 , 王嘉铭 , 桑玲
- 申请人: 全球能源互联网研究院 , 国家电网公司 , 国网山东省电力公司
- 申请人地址: 北京市昌平区未来科技城北区国网智能电网研究院院内; ;
- 专利权人: 全球能源互联网研究院,国家电网公司,国网山东省电力公司
- 当前专利权人: 全球能源互联网研究院,国家电网公司,国网山东省电力公司
- 当前专利权人地址: 北京市昌平区未来科技城北区国网智能电网研究院院内; ;
- 代理机构: 北京安博达知识产权代理有限公司
- 代理人: 徐国文
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L29/06 ; H01L21/336
The invention provides a super-junction silicon carbide device and a preparation method thereof. The preparation method includes growing a first epitaxial layer with a first conductive type on the right side of a silicon carbide substrate with the first conductive type; forming one or more trenches in the first epitaxial layer; and successively growing a plurality of second epitaxial layers with a second conductive type in the trenches from the bottom to the top until the filling of the trenches is completed, and forming a super-junction structure. Compared with the prior art, the super-junction silicon carbide device and the preparation method thereof provided allow the plurality of second epitaxial layers with the second conductive type in the trenches from the bottom to the top until the filling of the trenches is completed to form the super-junction structure, the number of the epitaxial layers and the thickness of each epitaxial layer can be adjusted according to the depth of the trenches, the gapless filling of the trenches can be realized, the problem that the top of the trenches is sealed in advance can be prevented, and meanwhile, the preparation method is simple in process, low in cost, and is convenient for industrialized production of the super-junction silicon carbide.
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L29/00 | 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件 |
--------H01L29/02 | .按其半导体本体的特征区分的 |
----------H01L29/68 | ..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的 |
------------H01L29/70 | ...双极器件 |
--------------H01L29/762 | ....电荷转移器件 |
----------------H01L29/78 | .....由绝缘栅产生场效应的 |