
基本信息:
- 专利标题: 一种应用杯芳烃制作印制电路板的方法
- 专利标题(英):Method for producing printed circuit board by using calixarene
- 申请号:CN201710103611.2 申请日:2017-02-24
- 公开(公告)号:CN106852005A 公开(公告)日:2017-06-13
- 发明人: 吴子坚 , 刘镇权 , 陈世荣 , 程静 , 邬通芳
- 申请人: 广东成德电子科技股份有限公司 , 广东工业大学
- 申请人地址: 广东省佛山市顺德区大良红岗居委会金斗组;
- 专利权人: 广东成德电子科技股份有限公司,广东工业大学
- 当前专利权人: 广东成德电子科技股份有限公司,广东工业大学
- 当前专利权人地址: 广东省佛山市顺德区大良红岗居委会金斗组;
- 代理机构: 北京中济纬天专利代理有限公司
- 代理人: 孔凡亮
- 主分类号: H05K3/12
- IPC分类号: H05K3/12
The invention discloses a method for producing a printed circuit board by using calixarene. The method comprises the following steps of: a) adding the calixarene and an organic solvent into a container with a stirring device separately at normal pressure and temperature, and stirring the calixarene and the organic solvent continuously so as to obtain a calixarene solution; b) adding liquid copper slurry and the calixarene solution to a container with a dispersion device separately at normal pressure and temperature, performing dispersion continuously, filtering out the material so as to obtain a primary printing liquid; c) drilling and cleaning a substrate, and placing the substrate on a screen printing machine; d) applying the obtained primary printing liquid to the screen printing machine and applying the primary printing liquid to the substrate to form a printing liquid layer; and e) baking the obtained substrate in a baking oven and then naturally cooling the substrate so as to obtain the printed circuit board. The method for producing the printed circuit board by using calixarene is friendly to environment, can improve the adhesive force of copper particles on the substrate, and reduces the impedance of a conductive line.
公开/授权文献:
- CN106852005B 一种应用杯芳烃制作印制电路板的方法 公开/授权日:2019-05-14
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K3/00 | 用于制造印刷电路的设备或方法 |
--------H05K3/02 | .其中将导电材料敷至绝缘支承物的表面上,而后再将其导电材料从不希望让电流通导或屏蔽的表面区域中去除的 |
----------H05K3/12 | ..应用印刷技术涂加导电材料的 |