![一种共形电路及其制备方法](/CN/2015/1/152/images/201510760302.jpg)
基本信息:
- 专利标题: 一种共形电路及其制备方法
- 专利标题(英):Conformal circuit and preparation method therefor
- 申请号:CN201510760302.3 申请日:2015-11-10
- 公开(公告)号:CN106686878A 公开(公告)日:2017-05-17
- 发明人: 容锦泉 , 徐涛 , 蔡恒生
- 申请人: 香港理工大学
- 申请人地址: 中国香港九龙红磡
- 专利权人: 香港理工大学
- 当前专利权人: 香港理工大学
- 当前专利权人地址: 中国香港九龙红磡
- 代理机构: 深圳市顺天达专利商标代理有限公司
- 代理人: 郭伟刚
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K3/18 ; H05K3/20
The invention provides a conformal circuit and a preparation method therefor. The preparation method for the conformal circuit comprises the following steps of S1, irradiating a substrate by laser to form a circuit structure on the substrate; S2, immersing the substrate in a chemical copper-plating solution to plate the circuit structure with copper, wherein the substrate comprises a laser processing layer, and the circuit structure is formed on the laser processing layer; the step S1 also a step of preparing the laser processing layer; the preparation of the laser processing layer comprises a step S11a or a step S11b, wherein the step S11a is as follows: mixing oxidizing agent and plastic into a solvent to form a mixture; and then evaporating the solvent in the mixture so as to form the laser processing layer; and the step S11b is as follows: uniformly mixing the oxidizing agent, epoxy resin, a hardening agent and acetone to form epoxy resin coating; and then curing the epoxy resin coating so as to form the laser processing layer. The conformal circuit produced by the invention is more flexible in design and higher in production efficiency.
公开/授权文献:
- CN106686878B 一种共形电路及其制备方法 公开/授权日:2019-06-28
IPC结构图谱:
H | 电学 |
--H05 | 其他类目不包含的电技术 |
----H05K | 印刷电路;电设备的外壳或结构零部件;电气元件组件的制造 |
------H05K1/00 | 印刷电路 |
--------H05K1/02 | .零部件 |