
基本信息:
- 专利标题: 高密度封装体、引线框架、封装单元及封装方法
- 专利标题(英):High-density packaging body, lead wire framework, packaging unit and packaging method
- 申请号:CN201611236826.3 申请日:2016-12-28
- 公开(公告)号:CN106684064A 公开(公告)日:2017-05-17
- 发明人: 向荣忠 , 阳小芮
- 申请人: 上海凯虹科技电子有限公司 , 达迩科技(成都)有限公司 , 上海凯虹电子有限公司
- 申请人地址: 上海市松江区出口加工区三庄路18弄1号; ;
- 专利权人: 上海凯虹科技电子有限公司,达迩科技(成都)有限公司,上海凯虹电子有限公司
- 当前专利权人: 上海凯虹科技电子有限公司,达迩科技(成都)有限公司,上海凯虹电子有限公司
- 当前专利权人地址: 上海市松江区出口加工区三庄路18弄1号; ;
- 代理机构: 上海翼胜专利商标事务所
- 代理人: 翟羽; 高翠花
- 主分类号: H01L23/49
- IPC分类号: H01L23/49 ; H01L23/495 ; H01L21/48
The invention provides a high-density packaging body, a lead wire framework, a packaging unit and a packaging method. A high-density packaging array comprises a plurality of packaging bodies, wherein each packaging body includes a packaging part and a plurality of pins protruding from the packaging part; every two adjacent pins of each packaging body are connected through a barrier strip; and the pins of each packaging body are mutually separated from the barrier strips of the adjacent packaging body. The high-density packaging body, the lead wire framework, the packaging unit and the packaging method have the advantages that as the pins of each packaging body are mutually separated from the barrier strips of the adjacent packaging body, thus reducing the space occupied by the pins, improving the packaging density; a high-density packaging array can be provided; the distance between the barrier strips and the packaging bodies can be increased; and during the plastic packaging process, barrier blocks of a die can be inserted between the barrier strips and the packaging bodies, thus avoiding generation of flash fundamentally.
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L23/00 | 半导体或其他固态器件的零部件 |
--------H01L23/34 | .冷却装置;加热装置;通风装置或温度补偿装置 |
----------H01L23/482 | ..由不可拆卸地施加到半导体本体上的内引线组成的 |
------------H01L23/49 | ...类似线状的 |