The invention provides a packaging technology of a ceramic chip. The packaging technology comprises the following steps of (I) dispensing and film-forming, before chip assembly, coating the edge of one side, which needs to be packaged with a cover plate, of a ceramic carrier with a liquid-like dual-curable sealant through a glue dispenser, and curing and setting the dual-curable sealant through UV light irradiation to form a structural film on the ceramic carrier; (2) chip assembly, namely carrying out chip assembly on the ceramic carrier; and (3) cured sealing, after chip assembly is completed, bonding the cover plate matched with the ceramic carrier in size and the ceramic carrier through heating the structural film and then carrying out cured sealing. The packaging structure of the ceramic chip has the practical advantages of high bonding strength, good surface wettability, high air-tightness and the like, the roll-to-roll automatic dispensing process can be achieved and the production efficiency is obviously improved.