The invention relates to preparation of phenolic epoxy resin materials. The technical scheme includes: accurately weighing all following raw materials of, by weight, 15-30g of linear phenolic epoxy resin, 25g of bisphenol-A epoxy resin, 10g of an epoxy resin toughening agent, 8g of nonyl phenol, 0.5g of gaseous silicon, 0.4g of an Anti-terra-U dispersing agent, 0.3g of BYK A-506 defoamer, 15g of carbon 12 and 14 alkyl glycidyl ether, 30g of silica powder and 10-30g of talcum powder; sequentially adding the above components into a dual planetary power mix blender, under the condition that the autorotation speed is 900-1200r/min and revolution speed is 15r/min, obtaining a component A after 3-6 hours of mechanical blending, and evenly mixing to obtain a component B of an epoxy resin adhesive prior to packaging for standby use; evenly mixing, by weight, 10g of curing agent hydroxyethyl ethylenediamine, 35g of isophorone diamine, 22g of polyether amine and 8g of dual (4-amino-3-methyl cyclohexyl) methane to obtain a curing agent of the epoxy resin adhesive and packaging for standby use.