![一种脆性材料打孔方法](/CN/2016/1/195/images/201610975424.jpg)
基本信息:
- 专利标题: 一种脆性材料打孔方法
- 申请号:CN201610975424.9 申请日:2016-11-07
- 公开(公告)号:CN106392341B 公开(公告)日:2019-06-11
- 发明人: 王建刚 , 王雪辉 , 刘柱 , 孙威 , 李国栋 , 程伟
- 申请人: 武汉华工激光工程有限责任公司
- 申请人地址: 湖北省武汉市武汉东湖高新技术开发区华中科技大学科技园华工科技激光产业园
- 专利权人: 武汉华工激光工程有限责任公司
- 当前专利权人: 武汉华工激光工程有限责任公司
- 当前专利权人地址: 湖北省武汉市武汉东湖高新技术开发区华中科技大学科技园华工科技激光产业园
- 代理机构: 武汉开元知识产权代理有限公司
- 代理人: 黄行军
- 主分类号: B23K26/382
- IPC分类号: B23K26/382 ; B23K26/402 ; B23K26/0622
The invention relates to the technical field of laser punching, in particular to a brittle material punching method. Filamentation cutting is carried out on a brittle material to be processed with ultrashort laser pulse beams to form round rings penetrating through the brittle material; an ablation area is arranged in each round ring, each ablation area is of an appointed shape, the parts, of the appointed shapes, of the brittle material are removed in a laser ablation manner, and single bodies to be splintered which are not connected with one another and to be subjected to splintering processing are formed; and splintering processing is carried out on the single bodies to be splintered at the same time, so that punching machining on the brittle material is realized. Because filamentation cutting and laser ablation are combined, edge breakage of the brittle material is reduced, the area of the heat affect zone of the brittle material is reduced, the efficiency of punching is improved, the success rate of punching is increased, the cost is reduced, and the problems about efficiency and effect in the machining process are solved.
公开/授权文献:
- CN106392341A 一种脆性材料打孔方法 公开/授权日:2017-02-15
IPC结构图谱:
B23K26/001 | .这个大组包括:激光加工用于制造削弱层,有或没有移除材料 |
--B23K26/352 | .用于表面处理的 |
----B23K26/362 | ..激光刻蚀 |
------B23K26/382 | ...打孔 |