
基本信息:
- 专利标题: 垂直连接型功率模块
- 专利标题(英):Vertical connection-type power module
- 申请号:CN201510387590.2 申请日:2015-07-03
- 公开(公告)号:CN106328621A 公开(公告)日:2017-01-11
- 发明人: 赵波 , 周哲 , 刘海军 , 任西周 , 宋洁 , 祁欢欢 , 彭傊 , 牛萌 , 刘宗烨
- 申请人: 国网智能电网研究院 , 国网浙江省电力公司国家电网公司
- 申请人地址: 北京市昌平区小汤山镇大东流村路270号(未来科技城)
- 专利权人: 国网智能电网研究院,国网浙江省电力公司国家电网公司
- 当前专利权人: 国网智能电网研究院,国网浙江省电力公司国家电网公司
- 当前专利权人地址: 北京市昌平区小汤山镇大东流村路270号(未来科技城)
- 代理机构: 北京安博达知识产权代理有限公司
- 代理人: 徐国文
- 主分类号: H01L23/49
- IPC分类号: H01L23/49
The invention provides a vertical connection-type power module, which comprises a power device, a power device gate contact chip, a power device source contact chip, a power device drain contact chip, a gate spring copper cylinder, a source spring copper cylinder and a DBC substrate, wherein the power device gate contact chip and the power device source contact chip are arranged on one side surface of the power device; the power device drain contact chip is arranged between the other side surface of the power device and the DBC substrate; the gate spring copper cylinder is connected with the power device gate contact chip; and the source spring copper cylinder is connected with the power device source contact chip. Compared with the prior art, the vertical connection-type power module provided by the invention has the advantages that the size of the power module is reduced and the size of a required radiator can be correspondingly reduced, thereby reducing the volume and the weight of a converter system.
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L23/00 | 半导体或其他固态器件的零部件 |
--------H01L23/34 | .冷却装置;加热装置;通风装置或温度补偿装置 |
----------H01L23/482 | ..由不可拆卸地施加到半导体本体上的内引线组成的 |
------------H01L23/49 | ...类似线状的 |