The invention provides a bonding method and a bonding device for a chip on film and display panels. The bonding device comprises a bearing platform, a grabbing unit, a driving unit, a controller, a detection unit and a bonding unit. The grabbing unit is arranged above the bearing platform and used for grabbing at least part of regions of a whole chip on film; the driving unit is used for enabling relative motion of the grabbing unit and the bearing platform; the controller is in signal connection with the driving unit and the detection unit; the detection unit is used for detecting relative position information of a row of first bonding areas and a row of second bonding areas, and when the row of the first bonding areas and the row of the second bonding areas are aligned, the detection unit sends alignment stopping information to the controller, and the controller controls the driving unit to stop alignment according to the alignment stopping information; the bonding unit is used for bonding the row of the first bonding areas and the row of the second bonding areas after alignment.