基本信息:
- 专利标题： 半导体发光器件
- 申请号：CN201610357748.6 申请日：2016-05-26
- 公开(公告)号：CN106206862B 公开(公告)日：2019-06-07
- 发明人： 车南煹 , 林完泰 , 金容一 , 卢慧锡 , 申珢珠 , 沈成铉 , H·柳
- 申请人： 三星电子株式会社
- 申请人地址： 韩国京畿道
- 专利权人： 三星电子株式会社
- 当前专利权人： 三星电子株式会社
- 当前专利权人地址： 韩国京畿道
- 代理机构： 北京天昊联合知识产权代理有限公司
- 代理人： 张帆; 崔卿虎
- 优先权： 10-2015-0073930 2015.05.27 KR
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L33/22 ; H01L33/50 ; H01L33/58
A semiconductor light emitting device includes: a light emitting structure including a first conductivity-type semiconductor layer and a second conductivity-type semiconductor layer respectively providing a first surface and a second surface, opposite to each other, of the light emitting structure, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer, a region of the first conductivity-type semiconductor layer being open toward the second surface, and the first surface having a concavo-convex portion disposed thereon; a first electrode and a second electrode disposed on the region of the first conductivity-type semiconductor layer and a region of the second conductivity-type semiconductor layer, respectively; a transparent support substrate disposed on the first surface of the light emitting structure; and a transparent adhesive layer disposed between the first surface of the light emitting structure and the transparent support substrate.
公开/授权文献:
- CN106206862A 半导体发光器件 公开/授权日：2016-12-07