The invention relates to a full-automatic ball mounting device and an application thereof. The device comprises a ball supplying mechanism, a ball mounting net plate (5) and a six-axis manipulator (7); the ball supplying mechanism comprises a ball supplying box (4), a ball supplying pipe (1), a ball supplying air cylinder (2) and a linear module (8), wherein the ball supplying box (4) is erected on the linear module (8) and communicates with the ball supplying pipe (1); the ball supplying air cylinder (2) opens and closes so that solder balls in the ball supplying box (4) can pass through the ball supplying pipe (1) and are uniformly distributed on one side of the ball mounting net plate (5); net holes corresponding to wafer PAD points and used for leaking the solder balls are processed in the ball mounting net plate (5), and the six-axis manipulator (7) is fixed on one side of the ball mounting net plate (5). Compared with the prior art, the device has the advantages that the efficiency is improved and the structure is simple.