基本信息:
- 专利标题： 晶圆旋转装置
- 申请号：CN201610080193.5 申请日：2016-02-04
- 公开(公告)号：CN106098590B 公开(公告)日：2018-11-30
- 发明人： 张元豪 , 李德浩 , 施英汝 , 徐文庆
- 申请人： 环球晶圆股份有限公司
- 申请人地址： 中国台湾新竹市科学工业园区东二路8号
- 专利权人： 环球晶圆股份有限公司
- 当前专利权人： 环球晶圆股份有限公司
- 当前专利权人地址： 中国台湾新竹市科学工业园区东二路8号
- 代理机构： 上海翼胜专利商标事务所
- 代理人： 翟羽
- 优先权： 104113930 2015.04.30 TW
- 主分类号： H01L21/67
- IPC分类号： H01L21/67
A wafer rotating apparatus includes a base, a carrying device, a first shaft gear, a power unit, a roller, a second shaft gear and a driving assembly. The base has an accommodating space which the carrying device is disposed in to accommodate the wafer. The first shaft gear is disposed on a side surface of the base. The power unit is assembled to a top of the base and connected to the first shaft gear. The roller is located under the carrying device and supports an edge of the wafer. The second shaft gear is disposed on the side surface of the base and connected to the roller. The driving assembly is connected between the first shaft gear and the second shaft gear. The power unit provides a power through the first gear, the driving unit and the second shaft gear to drive the roller to rotate the wafer.
公开/授权文献:
- CN106098590A 晶圆旋转装置 公开/授权日：2016-11-09
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
| --------H01L21/67 | .专门适用于在制造或处理过程中处理半导体或电固体器件的装置；专门适合于在半导体或电固体器件或部件的制造或处理过程中处理晶片的装置 |