基本信息:
- 专利标题： 焊料供给系统
- 申请号：CN201480076180.X 申请日：2014-02-26
- 公开(公告)号：CN106029278B 公开(公告)日：2018-11-16
- 发明人： 加藤光昭 , 藤田阳司
- 申请人： 株式会社富士
- 申请人地址： 日本爱知县知立市
- 专利权人： 株式会社富士
- 当前专利权人： 株式会社富士
- 当前专利权人地址： 日本爱知县知立市
- 代理机构： 中原信达知识产权代理有限责任公司
- 代理人： 穆德骏; 谢丽娜
- 国际申请： PCT/JP2014/054700 2014.02.26
- 国际公布： WO2015/128967 JA 2015.09.03
- 进入国家日期： 2016-08-23
- 主分类号： B23K3/06
- IPC分类号： B23K3/06 ; H05K3/34
A solder supply system that judges whether solder cup 70 is set on solder supply device 26. In a case in which it is judged that the solder cup is set on the solder supply device, reading a barcode by barcode reader 170 is allowed. In contrast, in a case in which it is judged that the solder cup is not set on the solder supply device, reading a barcode by the barcode reader is restricted. That is, reading a barcode by the barcode reader before the solder cup is set inside outer tube 72 is restricted, while reading a barcode by the barcode reader is allowed when the solder container is set inside outer tube 72. Thus, verification work is only able to be performed for solder cups actually set on solder supply device 26, which prevents operator mistakes and enables verification work of solder containers to be performed appropriately.
公开/授权文献:
- CN106029278A 焊料供给系统 公开/授权日：2016-10-12
IPC结构图谱:
| B | 作业；运输 |
| --B23 | 机床；不包含在其他类目中的金属加工 |
| ----B23K | 钎焊或脱焊；焊接；用钎焊或焊接方法包覆或镀敷；局部加热切割，如火焰切割；用激光束加工 |
| ------B23K3/00 | 用于钎焊，如硬钎焊或脱焊的工具、设备或专用附属装置，不专门适用于特殊方法的 |
| --------B23K3/06 | .钎料供给设备；钎料熔化盘 |