The present invention discloses a power conversion circuit package module and a manufacture method thereof. A system plate can be mounted at the surface of the power conversion circuit package module. The power conversion circuit package module comprises a substrate, a power device chip, a plastic package layer and a plurality of pins. The substrate has a metal layer, an insulation substrate layer and a heat conduction layer, and the insulation substrate layer is located between the metal layer and the heat conduction layer. The power device chip is connected with the metal layer, and all the devices on the metal layer of the substrate are embedded in the plastic package layer. The pins are electrically connected with the metal layer and are embedded into the plastic package layer, a contact surface which is electrically connected with the pins and the system plate is at least exposed. The contact surface is parallel to and/or perpendicular to the heat conduction layer. The power conversion circuit package module is small in occupation area and is helpful for batch manufacturing.