The invention discloses an aluminum nitride multilayer-ceramic leadless-periphery flat packaging shell and relates to the technical field of ceramic packaging. The aluminum nitride multilayer-ceramic leadless-periphery flat packaging shell comprises a ceramic shell having an upward opening, the center of the lower surface of a ceramic shell base plate is provided with a center pad, a leading-out end pad is arranged at the periphery of the center pad, a gap is provided between the center pad and the leading-out end pad, the ceramic shell is made from aluminum nitride, the center of the upper surface of the ceramic shell base plate is provided with a chip bonding area, a lead bonding area is arranged at the periphery of the chip bonding area, the lead bonding area is radial in shape, the outer wall at the periphery of the ceramic shell is provided with a plurality of metal conduction grooves, the chip bonding area is connected with the lead bonding area through bonding wires, and the lead bonding area is connected with the leading-out end pad through the metal conduction grooves. The aluminum nitride multilayer-ceramic leadless-periphery flat packaging shell features high heat-radiating performance and high reliability, post-integration device size and weight can be effectively reduced to enable miniaturization, and the heat-radiating requirement of power devices is met.