
基本信息:
- 专利标题: 增强型GaN基高电子迁移率晶体管及其制备方法
- 专利标题(英):Enhanced GaN-based high electron mobility transistor and preparation method thereof
- 申请号:CN201610331114.3 申请日:2016-05-18
- 公开(公告)号:CN105845723A 公开(公告)日:2016-08-10
- 发明人: 黄森 , 刘新宇 , 王鑫华 , 魏珂
- 申请人: 中国科学院微电子研究所
- 申请人地址: 北京市朝阳区北土城西路3号
- 专利权人: 中国科学院微电子研究所
- 当前专利权人: 中国科学院微电子研究所
- 当前专利权人地址: 北京市朝阳区北土城西路3号
- 代理机构: 北京汇泽知识产权代理有限公司
- 代理人: 张瑾
- 主分类号: H01L29/778
- IPC分类号: H01L29/778 ; H01L29/06 ; H01L21/335
The invention provides a GaN-based enhanced high electron mobility transistor and a preparation method thereof. The transistor comprises a substrate GaN buffer layer, a barrier layer and a passivation layer from the bottom to the top. The transistor further comprises a gate groove which runs through the high temperature resistance passivation layer, the barrier layer and a two-dimensional electron gas layer on the interface of the barrier layer and the GaN buffer layer and extends into the GaN buffer layer. A P-type gate dielectric layer grows in the gate groove. The gate of the transistor is located above the P-type gate dielectric layer. The source and the drain of the transistor are respectively located on both sides of the GaN buffer layer. According to the invention, higher gate threshold voltage can be acquired; and the defects of difficult control of etching damage and damaged conduction channel carrier mobility caused by over-etching can be overcome.
公开/授权文献:
- CN105845723B 增强型GaN基高电子迁移率晶体管及其制备方法 公开/授权日:2019-03-15
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L29/00 | 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件 |
--------H01L29/02 | .按其半导体本体的特征区分的 |
----------H01L29/68 | ..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的 |
------------H01L29/70 | ...双极器件 |
--------------H01L29/762 | ....电荷转移器件 |
----------------H01L29/778 | .....带有二维载流子气沟道的,如HEMT |