The invention relates to a fabrication method for a package structure having an electromagnetic shielding function. The method comprises the following steps of 1, arranging a chip on a substrate by an inverted assembly method; 2, taking a film, carrying out vacuum film press on the upper surface of the chip so that the film covers the upper surface of the substrate and is in contact with the surface and the side surface of the chip; 3, removing the redundant film for shielding the surrounding of the chip by a photoetching developing etching process; 4, electrically connecting other chips or a reactive device to the substrate; and 5, carrying out encapsulation and ball placement on the substrate, and finally cutting the substrate to a single product. According to the fabrication method for the package structure having the electromagnetic shielding function, an adhesive film with a metal plating layer is directly pasted onto the surface of a radio frequency chip or other chips requiring electromagnetic shielding, so that the purpose of shielding electromagnetic interference is achieved.