
基本信息:
- 专利标题: 印刷电路板装配检测系统及其检测方法
- 申请号:CN201410853056.1 申请日:2014-12-31
- 公开(公告)号:CN105806848B 公开(公告)日:2019-06-07
- 发明人: 孟宪明 , 孙武雄 , 廖祝湘 , 张基霖 , 廖伟然 , 陈志远 , 陈烱奇 , 翁仁龙 , 杨胜安
- 申请人: 技嘉科技股份有限公司
- 申请人地址: 中国台湾新北市
- 专利权人: 技嘉科技股份有限公司
- 当前专利权人: 技嘉科技股份有限公司
- 当前专利权人地址: 中国台湾新北市
- 代理机构: 隆天知识产权代理有限公司
- 代理人: 李昕巍; 赵根喜
- 主分类号: G01N21/95
- IPC分类号: G01N21/95
The invention discloses a printed circuit board assembly and detection system which is used for detecting whether part assembly on a printed circuit board assembly structure has faults; the system includes a first light source, an image extraction device, a control device and a detection and analysis device. The first light source is used for projecting light to the back of the printed circuit board assembly structure, wherein the printed circuit board assembly structure is provided with a plurality of through holes for assembling a plurality of parts, and at least three fixing holes for fixing. The image extracting device is used for extracting a first front image of the printed circuit board assembly structure. The control device is used for controlling the first light source and the image extracting device, to make the image extracting device obtain the first front image after the first light source is started. The detection and analysis device is used for analyzing the first front image. If a through hole light spot is detected to appear, the printed circuit board assembly structure is judged to have a missing part.
公开/授权文献:
- CN105806848A 印刷电路板装配检测系统及其检测方法 公开/授权日:2016-07-27
IPC结构图谱:
G | 物理 |
--G01 | 测量;测试 |
----G01N | 借助于测定材料的化学或物理性质来测试或分析材料 |
------G01N21/00 | 利用光学手段,即利用红外光、可见光或紫外光来测试或分析材料 |
--------G01N21/01 | .便于进行光学测试的装置或仪器 |
----------G01N21/88 | ..测试瑕疵、缺陷或污点的存在 |
------------G01N21/95 | ...特征在于待测物品的材料或形状 |