A heat dissipation module comprises a fixed frame, and a plurality of fans and a plurality of wind shielding devices mounted inside the fixed frame. The fixed frame is provided with a plurality of ventilation areas corresponding to the fans. The wind shielding devices are respectively mounted in the ventilation areas. Each wind shielding device includes a mounting box rotationally mounted in the corresponding ventilation area and a plurality of wind shielding plates, One side of each wind shielding plate is equipped with a pivot shaft rotationally mounted between the two sides of the mounting box, and the center of gravity of the mounting box is constructed such that one end of the mounting box adjacent to one sides, away from the corresponding pivot shafts, of the wind shielding plates is at the bottom under a static state. The wind shielding devices of the heat dissipation module are rotationally arranged inside the fixed frame. When the use state of an electronic device changes, the weight droppers of the wind shielding devices are at the bottom after rotation under the action of gravity, so the wind shielding plates are always kept in a horizontal state. The invention further discloses an electronic device with the heat dissipation module.