
基本信息:
- 专利标题: 圆筒状凸版印刷原版的制造方法
- 专利标题(英):Method for manufacturing cylindrical relief-printing plate
- 申请号:CN201480058000.5 申请日:2014-10-28
- 公开(公告)号:CN105705335A 公开(公告)日:2016-06-22
- 发明人: 八和田雪美 , 和田通
- 申请人: 东洋纺株式会社
- 申请人地址: 日本国大阪府大阪市北区堂岛浜二丁目2番8号
- 专利权人: 东洋纺株式会社
- 当前专利权人: 东洋纺MC株式会社
- 当前专利权人地址: 日本国大阪府大阪市北区梅田一丁目13番1号大阪梅田双子塔南栋
- 代理机构: 上海市华诚律师事务所
- 代理人: 李晓
- 优先权: 2013-224196 2013.10.29 JP
- 国际申请: PCT/JP2014/078642 2014.10.28
- 国际公布: WO2015/064579 JA 2015.05.07
- 进入国家日期: 2016-04-21
- 主分类号: B41C1/05
- IPC分类号: B41C1/05 ; B41C1/18 ; B41N1/12 ; B41N1/22
This method for manufacturing a cylindrical relief-printing plate by wrapping a printing-plate sheet around a cylindrical support provides a cylindrical relief-printing plate that exhibits high joint strength at the ends thereof such that the printing plate does not come loose, even when laser engraving is applied. Said method includes the following steps: (i) a step in which a printing-plate sheet that has, on the surface thereof, an uncured photosensitive-resin layer with a compressive strength at 25 DEG C between 1.0 and 3.0 kgf/cm2, inclusive, is produced; (ii) a step in which said printing-plate sheet is wrapped around a cylindrical support such that the edge where the wrapping starts and the edge where the wrapping ends overlap; and (iii) a step in which the overlap section where the edge where the wrapping starts and the edge where the wrapping ends overlap is pressure-bonded via the application of pressure at a temperature between 10 DEG C and 40 DEG C, inclusive. This method may also include a step (iv), after step (iii), in which the uncured photosensitive-resin layer is light-cured and may also include a step (v), after step (iv), in which the overlap section is ground, polished, and/or machined.
公开/授权文献:
- CN105705335B 圆筒状凸版印刷原版的制造方法 公开/授权日:2018-01-23
IPC结构图谱:
B | 作业;运输 |
--B41 | 印刷;排版机;打字机;模印机 |
----B41C | 印刷版的制造或复制工艺 |
------B41C1/00 | 印版准备 |
--------B41C1/02 | .雕版;雕版头 |
----------B41C1/04 | ..采用由电信号控制的雕版头 |
------------B41C1/05 | ...生热的雕版头,如激光束,电子束 |