The invention belongs to the related field of chip mounting equipment and discloses vertical flip-chip bonding equipment. The vertical flip-chip bonding equipment comprises a feeding assembly, a pasting assembly and a two-axis drive assembly, wherein the feeding assembly is used for finishing supplying of a chip; the pasting assembly comprises a turn plate assembly and matched gear dialing mechanism; the turn plate assembly comprises a turn plate, a cam mechanism and a plurality of nozzle assemblies; the axis of the turn plate is parallel to the X-axis direction; the cam mechanism is arranged in the turn plate; and the plurality of nozzle assemblies are distributed at intervals along the circumferential direction of the turn plate, so that the chip which is stamped out from a die plate is adsorbed and transferred and then pasted to a substrate. Furthermore, the gear dialing mechanism is arranged at one side adjacent to the turn plate, and is used for executing rotary motion of each suction assembly along the axis. Through the vertical flip-chip bonding equipment, high-efficiency and high-quality treatment for flip-chip bonding can be achieved through interrelation and cooperation among the various assemblies; and meanwhile, the vertical flip-chip bonding equipment has the advantages of being compact in structure, ingenious in layout, stable and reliable in operation and the like.