![层叠型压电陶瓷电子部件及层叠型压电陶瓷电子部件的制造方法](/CN/2014/8/10/images/201480053485.jpg)
基本信息:
- 专利标题: 层叠型压电陶瓷电子部件及层叠型压电陶瓷电子部件的制造方法
- 申请号:CN201480053485.9 申请日:2014-09-26
- 公开(公告)号:CN105593190B 公开(公告)日:2018-04-20
- 发明人: 石井秀树 , 川田慎一郎 , 林裕之 , 奥泽匡 , 铃木祥一郎
- 申请人: 株式会社村田制作所
- 申请人地址: 日本京都府
- 专利权人: 株式会社村田制作所
- 当前专利权人: 株式会社村田制作所
- 当前专利权人地址: 日本京都府
- 代理机构: 中科专利商标代理有限责任公司
- 代理人: 张玉玲
- 优先权: 2013-203722 2013.09.30 JP
- 国际申请: PCT/JP2014/075649 2014.09.26
- 国际公布: WO2015/046434 JA 2015.04.02
- 进入国家日期: 2016-03-28
- 主分类号: H01L41/083
- IPC分类号: H01L41/083
A multilayer sintered body 1 is a sintered form of alternately stacked Ni-based inner electrodes 3 and piezoelectric ceramic layers. The piezoelectric ceramic layers contain a perovskite compound containing Nb, K, Na, and Li, at least one element M1 selected from Nd and Dy, and at least one element M2 selected from Ga and Al, the perovskite compound being the main ingredient. The element M2 content is 0.071 parts by mole or less per 1 part by mole of the Nb in a solution obtained through a dissolution process. This multilayer piezoelectric ceramic electronic component is manufactured through the cofiring of conductive films as a precursor of the inner electrodes 3 and ceramic green sheets as a precursor of the piezoelectric ceramic layers in a reducing atmosphere in which the oxidation of Ni is inhibited. These provide a highly reliable multilayer piezoelectric ceramic electronic component and a method for manufacturing it.
公开/授权文献:
- CN105593190A 层叠型压电陶瓷电子部件及层叠型压电陶瓷电子部件的制造方法 公开/授权日:2016-05-18
IPC结构图谱:
H | 电学 |
--H04 | 电通信技术 |
----H04R | 扬声器、送话器、唱机拾音器或类似的传感器 |
------H01L41/02 | .零部件 |
--------H01L41/083 | ..具有堆叠或多层结构的 |