基本信息:
- 专利标题： 成膜用镍溶液和使用该溶液的成膜方法
- 申请号：CN201480048322.1 申请日：2014-10-02
- 公开(公告)号：CN105492665B 公开(公告)日：2018-06-29
- 发明人： 平冈基记 , 柳本博 , 佐藤祐规 , 新明良崇 , 赤松谦祐
- 申请人： 丰田自动车株式会社
- 申请人地址： 日本爱知县
- 专利权人： 丰田自动车株式会社
- 当前专利权人： 丰田自动车株式会社
- 当前专利权人地址： 日本爱知县
- 代理机构： 北京市中咨律师事务所
- 代理人： 段承恩; 李照明
- 优先权： 2013-208418 2013.10.03 JP
- 国际申请： PCT/JP2014/076378 2014.10.02
- 国际公布： WO2015/050192 JA 2015.04.09
- 进入国家日期： 2016-03-02
- 主分类号： C25D17/00
- IPC分类号： C25D17/00 ; C25D3/12
Provided is a nickel solution for forming a film that can suppress generation of hydrogen gas between a solid electrolyte membrane and a substrate while the solid electrolyte membrane and the substrate are brought into contact with each other. Specifically, provided is a nickel solution for forming a film, the nickel solution being adapted to, when disposing a solid electrolyte membrane between an anode and a substrate that functions as a cathode, bringing the solid electrolyte membrane into contact with the substrate and applying a voltage across the anode and the substrate so as to deposit nickel onto a surface of the substrate from nickel ions contained in the solid electrolyte membrane, thereby forming a nickel film containing the nickel on the surface of the substrate, supply the nickel ions to the solid electrolyte membrane. The pH of the nickel solution for forming a film is in the range of 4.2 to 6.1. The nickel solution for forming a film further contains a pH buffer solution that has a buffer function in the range of the pH and does not form insoluble salts or complexes with the nickel ions during formation of the film.
公开/授权文献:
- CN105492665A 成膜用镍溶液和使用该溶液的成膜方法 公开/授权日：2016-04-13
IPC结构图谱:
| C | 化学；冶金 |
| --C25 | 电解或电泳工艺；其所用设备 |
| ----C25D | 覆层的电解或电泳生产工艺方法；电铸；工件的电解法接合；所用的装置 |
| ------C25D17/00 | 电解镀覆用电解槽的结构件、或其组合件 |