The present invention relates to the field of surface mounting technology, and specially discloses a housing lead wire used for a surface-mount package of a microwave device and a connecting structure that uses the lead wire. The lead wire is flat and ribbon-shaped, is provided with a bending section that is omega-shaped and that has a radius of 0.10 mm - 0.30 mm, and the lead wire, except the bending section, is a straight line segment. The bending section is an arc that is a semicircle or greater than a semicircle. Two straight line end portions of the lead wire are a lead-in end and a lead-out end respectively; the lead-in end is used for connecting a package housing; the lead-out end is used for connecting a printed circuit board; and the bending section of the lead wire is close to the lead-out end. In the connecting structure, the distance between a bending degree and a ceramic base is 0.10 mm - 0.30 mm. According to the housing lead wire used for a surface-mount package of a microwave device and the connecting structure, a lead wire has better tensile and anti-plastic deformation performance, and also has a better microwave electric signal transmission capability; and by applying the lead wire to a microwave device, a tensile stress that the lead wire exerts on a housing when a temperature changes can be reduced or eliminated, and reliability of the device and better microwave performance can be ensured.