
基本信息:
- 专利标题: 压印用固化性组合物
- 申请号:CN201480032326.0 申请日:2014-05-23
- 公开(公告)号:CN105378893B 公开(公告)日:2017-09-01
- 发明人: 山口纯司 , 谷本尚志 , 伊部武史 , 矢田真 , 矢木直人
- 申请人: DIC株式会社
- 申请人地址: 日本东京都
- 专利权人: DIC株式会社
- 当前专利权人: DIC株式会社
- 当前专利权人地址: 日本东京都
- 代理机构: 北京林达刘知识产权代理事务所
- 代理人: 刘新宇; 李茂家
- 优先权: 2013-119772 20130606 JP 2014-009455 20140122 JP
- 国际申请: PCT/JP2014/063693 2014.05.23
- 国际公布: WO2014/196381 JA 2014.12.11
- 进入国家日期: 2015-12-04
- 主分类号: H01L21/027
- IPC分类号: H01L21/027 ; B29C59/02 ; C08F220/20
There is provided a curable composition for imprinting containing a polymerizable compound, in which (a) the concentration of a polymerizable group in the polymerizable compound is in the range of 4.3 mmol/g to 7.5 mmol/g, (b) a polymerizable compound X whose Ohnishi parameter is 3.5 or less and ring parameter is 0.35 or greater is contained in the range of 40% by mass to 95% by mass with respect to all the polymerizable compounds, (c) a polymerizable compound C having three or more polymerizable groups is further contained in the range of 5% by mass to 20% by mass with respect to all the polymerizable compounds, and (d) the viscosity of the composition being at 25° C. and in a state of not containing a solvent is in the range of 3 mPa·s to 8,000 mPa·s.
公开/授权文献:
- CN105378893A 压印用固化性组合物 公开/授权日:2016-03-02
IPC结构图谱:
H | 电学 |
--H01 | 基本电气元件 |
----H01L | 半导体器件;其他类目未包含的电固体器件 |
------H01L21/00 | 专门适用于制造或处理半导体或固体器件或其部件的方法或设备 |
--------H01L21/02 | .半导体器件或其部件的制造或处理 |
----------H01L21/027 | ..未在H01L21/18或H01L21/34组中包含的为进一步的光刻工艺在半导体之上制作掩膜 |