The invention provides a wafer bonding method and a bonding component of a wafer. The wafer bonding method comprises the following steps of forming a plurality of first embossments on a first fitting end surface of a first wafer, wherein first gaps are arranged among the plurality of first embossments; forming a plurality of second embossments on a second fitting end surface of a second wafer, wherein second gaps are arranged among the plurality of second embossments; the second gaps can accommodate the first embossments and the first gaps can accommodate the second embossments; and carrying out bonding technology on the first wafer and the second wafer. Sizes of the first embossments and the second embossments are smaller than sizes of a first fitting end and a second fitting end so that a contact surface between the first fitting end and the second fitting end is divided into a plurality of contact surfaces with small sizes. Because of depressions of first embossment surfaces and second embossment surfaces, a proportion of a key and a gap on the contact surface is reduced and an actual contact surface of the first fitting end and the second fitting end is effectively increased so that connection quality between the wafers is increased.