基本信息:
- 专利标题： 半导体中介板及封装结构
- 专利标题（英）：Semiconductor interposer and package structure having the same
- 申请号：CN201410198023.8 申请日：2014-05-12
- 公开(公告)号：CN105023882A 公开(公告)日：2015-11-04
- 发明人： 蔡君聆 , 吕长伦
- 申请人： 矽品精密工业股份有限公司
- 申请人地址： 中国台湾台中市
- 专利权人： 矽品精密工业股份有限公司
- 当前专利权人： 矽品精密工业股份有限公司
- 当前专利权人地址： 中国台湾台中市
- 代理机构： 北京戈程知识产权代理有限公司
- 代理人： 程伟; 王锦阳
- 优先权： 103114465 2014.04.22 TW
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/31
A semiconductor interposer is provided, which includes: a substrate body having a surface defined with an inner area and a peripheral area around the inner area; a plurality of conductive posts embedded in the substrate body and each having one end exposed from the surface of the substrate body; a passivation layer formed on the surface of the substrate body and having a peripheral portion formed in the peripheral area, a plurality of ring-shaped portions formed around peripheries of the exposed ends of the conductive posts in the inner area and a plurality of strip-shaped portions formed between the ring-shaped portions for connecting the ring-shaped portions; and a UBM layer formed on the exposed end of each of the conductive posts and extending on the ring-shaped portion around the periphery of the exposed end of the conductive post, thereby effectively reducing stresses to prevent warping of the semiconductor interposer.
公开/授权文献:
- CN105023882B 半导体中介板及封装结构 公开/授权日：2017-12-01
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/12 | .安装架，例如不可拆卸的绝缘衬底 |