The invention relates to a heat pipe semiconductor air conditioner which is characterized in that an internal cooling fin or an external cooling fin comprises a flaky base; a plurality of fins used for heat dissipation vertically extend out of one side surface of the base; vacuum heat pipe mounting grooves are formed from one side to the other side in the other side surface of the base; vacuum heat pipes are embedded into the vacuum heat pipe mounting grooves in an interference fit way; the projection of a semiconductor refrigeration chip on the base is intersected with the vacuum heat pipes in the vacuum heat pipe mounting grooves. A preparation method of the heat pipe semiconductor air conditioner comprises the steps of firstly, processing the vacuum heat pipe mounting grooves from one side to the other side in one side surface of the base of the internal cooling fin and the external cooling fin; secondly, putting heat transfer paste into the vacuum heat pipe mounting grooves; finally, embedding the vacuum heat pipes into the vacuum heat pipe mounting grooves by a press machine, and enabling the outer edge of the vacuum heat pipes to contact with the heat transfer paste. After the scheme is adopted, the refrigerating capacity of the semiconductor air conditioner is improved, or the use number of semiconductor refrigeration chips in the semiconductor air conditioner is reduced, and the manufacturing cost is lowered.