The present invention relates to a multi-layer ceramic electronic assembly and a board provided thereon with the multi-layer ceramic electronic assembly. The multi-layer ceramic electronic assembly comprises a multi-layer ceramic capacitor composed of a first ceramic body, a plurality of first inner electrodes, a plurality of second inner electrodes, a plurality of first outer electrodes and a plurality of second outer electrodes; and a ceramic chip composed of a first ceramic body, a third inner electrode, a fourth inner electrode, a first connecting terminal, a second connecting terminal, a first outer terminal and a second outer terminal. The second ceramic body is formed through stacking up a plurality of ceramic layers on the mounting surface of a multi-layer ceramic capacitor. The first and second connecting terminals are respectively extending to some parts of the upper surface of the ceramic body from the lateral surface of the second ceramic body respectively, and are respectively connected to the first and second outer electrodes of the multi-layer ceramic capacitor. The first and second outer terminals are respectively arranged on the end of the ceramic body, and are respectively connected to the exposed portions of the third and fourth inner electrodes respectively.