基本信息:
- 专利标题： 电子装置及其散热系统
- 专利标题（英）：Electronic device and heat-radiation system thereof
- 申请号：CN201410046758.9 申请日：2014-02-10
- 公开(公告)号：CN104797119A 公开(公告)日：2015-07-22
- 发明人： 赖正明 , 萧伟宗 , 邱宗祐 , 石伟达 , 黄耀德
- 申请人： 纬创资通股份有限公司
- 申请人地址： 中国台湾新北市
- 专利权人： 纬创资通股份有限公司
- 当前专利权人： 纬创资通股份有限公司
- 当前专利权人地址： 中国台湾新北市
- 代理机构： 隆天知识产权代理有限公司
- 代理人： 于宝庆; 刘春生
- 优先权： 103101556 2014.01.16 TW
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; G06F1/20
A heat-radiation system is applied to a mainboard. The mainboard comprises two processors. The heat-radiation system comprises a first heat-radiation element and a second heat-radiation element. The first heat-radiation element comprises a first substrate and a plurality of first cooling fins. The first substrate is connected with one of the processors. The first cooling fins are connected with the first substrate, and first distances are provided between the first cooling fins. The second heat-radiation element comprises a second substrate and a plurality of second cooling fins. The second substrate is connected with the other one of the processors. The second cooling fins are connected with the second substrate, and second distances are provided between the second cooling fins. The second distances are less than the first distances. Through design of an electronic device and the heat-radiation system, the good heat-radiation effect is provided. According to the design of an electronic device and the heat-radiation system, extra material cost cannot be improved.
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K7/00 | 对各种不同类型电设备通用的结构零部件 |
| --------H05K7/20 | .便于冷却、通风或加热的改进 |