基本信息:
- 专利标题： 芯片、芯片封装和管芯
- 专利标题（英）：Chip, chip package and die
- 申请号：CN201410751125.8 申请日：2014-12-10
- 公开(公告)号：CN104701282A 公开(公告)日：2015-06-10
- 发明人： R.阿林格 , G.比尔 , J.赫格尔
- 申请人： 英飞凌科技股份有限公司
- 申请人地址： 德国瑙伊比贝尔格市坎芘昂1-12号
- 专利权人： 英飞凌科技股份有限公司
- 当前专利权人： 英飞凌科技股份有限公司
- 当前专利权人地址： 德国瑙伊比贝尔格市坎芘昂1-12号
- 代理机构： 中国专利代理(香港)有限公司
- 代理人： 申屠伟进; 胡莉莉
- 优先权： 14/101370 2013.12.10 US
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/12
The invention relates to a chip, a chip package and a die. In various embodiments, a chip for a chip package is provided. The chip may include a substrate and an integrated circuit over the substrate. The integrated circuit may include a test circuit, for example a built-in self-test circuit, and an operation circuit, the test circuit including one or more first driver stages each having a first driver performance and the operation circuit including one or more second driver stages each having a second driver performance which is different from the first driver performance, first contacts electrically coupled with the first driver stages, and second contacts electrically coupled with the second driver stages, wherein the test circuit and the first contacts are configured to provide a test mode for testing the integrated circuit and wherein the operation circuit and the second contacts are configured to provide an operating mode of the integrated circuit being different from the test mode.
公开/授权文献:
- CN104701282B 芯片、芯片封装和管芯 公开/授权日：2018-04-06
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/48 | .用于向或自处于工作中的固态物体通电的装置，例如引线、接线端装置 |