The invention discloses and provides a direct hole metallization method based on laser drilling. The method is convenient and simple in process, energy-saving and environment-friendly due to the fact that a large number of chemicals are not consumed, and obtained metallized layers are better in adhesion property. The method comprises steps as follows: surface roughening treatment is performed on copper foil; laser drilling is performed, and the copper foil in hole positions is molten to collapse so as to cover hole walls; acid pickling is performed, and whole plate electroplating is performed after hole conditioning, and metallization of holes is finished. The method has the advantages that drilling and hole wall metallization procedures are combined into one step, hole wall metal layers are excellent in connection performance, the process cost is reduced, the production efficiency is improved, and the method is energy-saving and environment-friendly due to the fact that a large number of chemicals are not consumed.