基本信息:
- 专利标题： 安装结构体及增强用树脂材料的供给方法
- 专利标题（英）：Mounting structure and method for supplying reinforcing resin material
- 申请号：CN201280075640.8 申请日：2012-09-06
- 公开(公告)号：CN104604343A 公开(公告)日：2015-05-06
- 发明人： 时井诚治 , 田崎学
- 申请人： 松下知识产权经营株式会社
- 申请人地址： 日本大阪府
- 专利权人： 松下知识产权经营株式会社
- 当前专利权人： 松下知识产权经营株式会社
- 当前专利权人地址： 日本大阪府
- 代理机构： 上海专利商标事务所有限公司
- 代理人： 茅翊忞
- 国际申请： PCT/JP2012/005641 2012.09.06
- 国际公布： WO2014/037978 JA 2014.03.13
- 进入国家日期： 2015-03-04
- 主分类号： H05K3/28
- IPC分类号： H05K3/28
Provided are a structure on which an electronic component is mounted and a method for mounting an electronic component, which have a sufficient reinforcing effect with respect to a relatively tall electronic component mounted on a substrate while easily coping with a change in the shape and so forth of the electronic component. A mounting structure (1) is configured such that a substrate (2) and an electronic component (4) mounted on the substrate (2) are joined by a joining metal (3), and a reinforcing resin body (5) is bonded to both the substrate (2) and the electronic component (4). The reinforcing resin body (5) is constituted by a plurality of reinforcing resin layers (5a). The reinforcing resin body (5) is configured such that the reinforcing resin layers (5a) are laminated in the height direction of the mounted electronic component (4) along the side surface (4a) of the electronic component (4) mounted on the substrate (2).
公开/授权文献:
- CN104604343B 安装结构体及增强用树脂材料的供给方法 公开/授权日：2017-06-30
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/02 | .其中将导电材料敷至绝缘支承物的表面上，而后再将其导电材料从不希望让电流通导或屏蔽的表面区域中去除的 |
| ----------H05K3/28 | ..涂加非金属保护层 |