基本信息:
- 专利标题： 用于钝化包含不透射线标志物之金属可植入医疗装置的方法
- 专利标题（英）：Methods for passivating metallic implantable medical devices including radiopaque markers
- 申请号：CN201380037121.7 申请日：2013-02-22
- 公开(公告)号：CN104583463A 公开(公告)日：2015-04-29
- 发明人： 林志诚
- 申请人： 艾博特心血管系统公司
- 申请人地址： 美国加利福尼亚州
- 专利权人： 艾博特心血管系统公司
- 当前专利权人： 艾博特心血管系统公司
- 当前专利权人地址： 美国加利福尼亚州
- 代理机构： 北京集佳知识产权代理有限公司
- 代理人： 郑斌; 彭鲲鹏
- 优先权： 13/548,908 2012.07.13 US
- 国际申请： PCT/US2013/027501 2013.02.22
- 国际公布： WO2014/011215 EN 2014.01.16
- 进入国家日期： 2015-01-12
- 主分类号： C25F3/18
- IPC分类号： C25F3/18 ; C25F3/16 ; A61F2/91
The present disclosure relates to methods of manufacturing and passivating stents and other implantable medical devices including one or more attached radiopaque markers. In one embodiment, the method includes providing a metallic implantable medical device body without any radiopaque marker(s) attached thereto, primary electropolishing the device body without any markers attached thereto, attaching one or more radiopaque markers to the device body, and lightly electropolishing the device including device body and attached radiopaque markers. Light electropolishing removes no more than about 5% by weight of the device (i.e., the device body and attached marker(s)). Light electropolishing passivates the exposed surfaces of the device body and markers, while also providing electropolishing to the region of any welds where the radiopaque marker(s) is/are attach to the device body.