基本信息:
- 专利标题： 利用微结构形成表面电浆的方法
- 申请号：CN201410006808.0 申请日：2014-01-07
- 公开(公告)号：CN104576873B 公开(公告)日：2017-07-14
- 发明人： 宗成圣 , 庄师豪
- 申请人： 宗成圣
- 申请人地址： 中国台湾南投县草屯镇中正路树人巷27弄3号
- 专利权人： 宗成圣
- 当前专利权人： 宗成圣
- 当前专利权人地址： 中国台湾南投县草屯镇中正路树人巷27弄3号
- 代理机构： 北京律诚同业知识产权代理有限公司
- 代理人： 王玉双; 鲍俊萍
- 优先权： 102136489 20131009 TW
- 主分类号： H01L33/44
- IPC分类号： H01L33/44
A method for fabricating a microstructure to generate surface plasmon waves comprises steps of: (S1) preparing a substrate (10), and (S2) using a carrier material (22) to carry a plurality of metallic nanoparticles (21) and letting the metallic nanoparticles (21) undertake self-assembly to form a microstructure on the substrate (10), wherein the metallic nanoparticles (21) are separated from each other or partially agglomerated to allow the microstructure to be formed with a discontinuous surface. The present invention fabricates the microstructure having the discontinuous surface by a self-assembly method to generate the surface plasmon waves, thus exempts from using the expensive chemical vapor deposition (CVD) technology and is able to reduce the time and cost of fabrication. The present invention also breaks the structural limitation on generation of surface plasmon waves to enhance the effect of generating the surface plasmon waves.
公开/授权文献:
- CN104576873A 利用微结构形成表面电浆的方法 公开/授权日：2015-04-29