基本信息:
- 专利标题： 印制布线基板
- 专利标题（英）：Printed wiring board
- 申请号：CN201510019211.4 申请日：2008-07-17
- 公开(公告)号：CN104540317A 公开(公告)日：2015-04-22
- 发明人： 池本伸郎 , 石野聪 , 道海雄也 , 加藤登 , 片矢猛 , 木村育平 , 田中干子
- 申请人： 株式会社村田制作所
- 申请人地址： 日本京都府
- 专利权人： 株式会社村田制作所
- 当前专利权人： 株式会社村田制作所
- 当前专利权人地址： 日本京都府
- 代理机构： 上海专利商标事务所有限公司
- 代理人： 俞丹
- 优先权： 2007-185439 2007.07.17 JP; 2007-271861 2007.10.18 JP; 2008-092848 2008.03.31 JP
- 分案原申请号： 2008800022094 2008.07.17
- 主分类号： H05K1/14
- IPC分类号： H05K1/14 ; H01Q1/24 ; H01Q1/38 ; H01Q1/40 ; H01Q9/28
The invention provides a printed wiring board which is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity. The printed wiring board is equipped a wireless IC device and radiation plates. The wireless IC device includes the wireless IC that processes transmission and reception signals, and a power supply circuit substrate that has a power supply circuit connected with the wireless IC. The radiation plates are electromagnetically coupled to the power supply circuit. The wireless IC device is provided with an installation electrode which is not in electrical connection with the power supply circuit. The wireless IC device is fixed on the printed wiring board through the installation electrode. The power supply circuit substrate is internally provided with a power supply electrode electromagnetically coupled to the radiation plates.
公开/授权文献:
- CN104540317B 印制布线基板 公开/授权日：2018-11-02
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K1/00 | 印刷电路 |
| --------H05K1/02 | .零部件 |
| ----------H05K1/14 | ..两个或更多个印刷电路的结构连接 |