基本信息:
- 专利标题： 电感结构及其制作方法
- 申请号：CN201410408611.X 申请日：2014-08-19
- 公开(公告)号：CN104425462B 公开(公告)日：2017-07-28
- 发明人： 赖伟铭 , 胡毓文
- 申请人： 精材科技股份有限公司
- 申请人地址： 中国台湾桃园县中坜市中坜工业区吉林路23号9F
- 专利权人： 精材科技股份有限公司
- 当前专利权人： 精材科技股份有限公司
- 当前专利权人地址： 中国台湾桃园县中坜市中坜工业区吉林路23号9F
- 代理机构： 北京林达刘知识产权代理事务所
- 代理人： 刘新宇
- 优先权： 61/870,138 20130826 US
- 主分类号： H01L23/64
- IPC分类号： H01L23/64 ; H01L21/02
A manufacturing method of an inductor structure includes the following steps. A protection layer is formed on a substrate, such that bond pads of the substrate are respectively exposed form protection layer openings of the protection layer. A conductive layer is formed on the bond pads and the protection layer. A patterned first photoresist layer is formed on the conductive layer. Copper bumps are respectively formed on the conductive layer located in the first photoresist layer openings. A patterned second photoresist layer is formed on the first photoresist layer, such that at least one of the copper bumps is exposed through second photoresist layer opening and the corresponding first photoresist layer opening. A diffusion barrier layer and an oxidation barrier layer are formed on the copper bump. The first and second photoresist layers, and the conductive layer not covered by the copper bumps are removed.
公开/授权文献:
- CN104425462A 电感结构及其制作方法 公开/授权日：2015-03-18
IPC结构图谱:
| H | 电学 |
| --H01 | 基本电气元件 |
| ----H01L | 半导体器件；其他类目未包含的电固体器件 |
| ------H01L23/00 | 半导体或其他固态器件的零部件 |
| --------H01L23/552 | .防辐射保护装置，例如光 |
| ----------H01L23/64 | ..阻抗装置 |